Time to market is a key challenge and a potential competitive advantage for IoT product developers.
Silicon Labs’ pre-certified xGM210x multiprotocol modules help reduce R&D cycles related to RF design and protocol development, allowing engineers to focus on their end applications. Pre-certified for North America, Europe, Korea and Japan, the modules minimize the time, cost and risk factors related to global wireless certifications.
Chalk Talk
Series 2 Product Security
In this episode of Chalk Talk, Amelia Dalton chats with Silicon Labs' Gregory Guez about DPA, secure debug, and the EFR32 Series 2 Platform.
xGM210P Broad-based Module
xGM210P Bluetooth, Zigbee, and Thread multiprotocol modules feature an optimized form-factor with integrated chip antenna and low profile for space-constrained IoT designs including smart lighting, HVAC, building and factory automation systems.
xGM210L Lighting Module
xGM210L modules combine a custom form factor to ease mounting inside LED bulb housings, PCB trace antenna to maximize wireless range, high temperature ratings, extensive global regulatory certifications and low active power consumption, delivering the perfect wireless solution for cost-sensitive, high-volume smart LED lightbulb.
Securing the IoT
xGM210x modules provide best-in-class features to enable developers to implement robust security in IoT products thanks to dedicated security core that isolates the application processor and delivers fast, energy-efficient cryptographic operations.
The Silicon Labs Advantage
Expertise
20+ years providing RF solutions with more than 1 billion deployed wireless nodes worldwide
Security
Providing enhanced security features that help developers increase consumer trust in connected products
Platform
Simplifying IoT product design with highly-integrated devices, reusable software and advanced development tools