Tuya’s Matter Over Thread Module Simplifies Developing Matter Devices
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Bridging the Gap Between Knowledge and IoT Development for a Fully Connected World
One of our aspirations at Silicon Labs is to make wireless IoT development more accessible every day, regardless of their level of engineering knowledge or wireless development experience. We make strides every day – especially with the help of partners who share the same vision – but it can be challenging to close the gap between knowledge and IoT development, especially when technology evolves so fast.
This is when enlisting the collaboration and know-how of domain experts becomes particularly valuable. They bring contributions that, coupled with ours, enhance people’s lives every day. We’ve talked about our work with Tuya in the past – a partner who understands that wireless design can be difficult, and manufacturers wanting to deliver the next big innovation for their customers might not have the engineering expertise required. This is why, using Silicon Labs’ EFR32MG24 Series 2 Multiprotocol SoC, Tuya built a no-code cloud developer platform that allows any device maker to go from prototype to mass production in just 15 days.
Tuya continues to innovate, this time with its Matter over Thread module. Let’s start by taking a closer look at the high-profile Matter standard, launched 2022, to better understand the impact Tuya and Silicon Labs’ work can have on its growth, adoption and overall impact to consumers.
Matter’s Rise Propels Interoperability
Matter has been in Silicon Labs’ vocabulary for quite some time. An ambitious protocol, its aim has been to achieve what many have been clamoring for – IoT interoperability across devices and ecosystems. The standard had garnered the attention of the world even before its launch, as it was backed by some of the world’s largest tech names with applications that span building automation, smart home, industrial IoT, and smart markets.
Tuya, a pioneer in interoperability since its founding in 2014, recognized that Matter could seamlessly align with their Thread wireless communication protocol.
The Challenge
Because of the IoT's quick rise, consumers have experienced fragmentation across devices and ecosystems, which can hamper adoption. Meanwhile, integrating the latest features and functionality can be complex for developers. One of Matter's central promises was that it would help address both of these challenges through interoperability.
The Solution
Tuya leveraged Silicon Labs’ EFR32MG24 Series 2 Multiprotocol SoC to develop a no-code platform and Matter over Thread module, simplifying smart device integration, reducing embedded workload, and accelerating time-to-market. All of this is done with Matter as the backbone.
The Result
The collaboration has resulted in Tuya's Matter over Thread module becoming a preferred choice for cloud developers and manufacturers who seek to create smart home, lighting, and building automation devices that pave the way for widespread smart solution adoption.
When the Pieces Come Together: Tuya’s Matter Over Thread Module Leverages Silicon Labs’ MG24
Our MG24 SoCs offer user-friendly device pairing and a smooth commissioning process, making them the preferred choice for developers looking to integrate Matter into their products. By leveraging Silicon Labs’ MG24 SoC, Tuya’s Matter over Thread module simplifies the development process. IoT manufacturers leverage a robust and easy-to-use platform that minimizes workload on the embedded side. This, in turn, helps these customers reduce development complexities and accelerate time to market for their products.
The proven MG24 SoC also offers:
- Technological Excellence: The MG24 SoC is designed for mesh IoT wireless connectivity using Matter, OpenThread, and Zigbee protocols. It features high-performance 2.4 GHz RF, low current consumption, an AI/ML hardware accelerator, and Secure Vault™ for robust security against cyber-attacks.
- Development Efficiency: Silicon Labs and Tuya focus on speeding up the development process for product designers. The unified development platform provided by Tuya and Silicon Labs ensures a streamlined process from conception to production.
- Complimentary Technology: The partnership between Tuya and Silicon Labs began with a mutual recognition of each other's strengths. Silicon Labs was seeking a renowned solution provider, while Tuya needed a globally recognized chip vendor with strong technical support and a vast network of potential customers. This collaboration has been fruitful, starting with their work on the Zigbee protocol and now extending to Matter.
- Market Demand: As an active member of the Connectivity Standards Alliance (CSA) and an advocate for Matter, Tuya has seen growing customer demand for Matter-compatible devices. Silicon Labs’ MG24 SoC was the clear frontrunner to meet this demand, thanks to its advanced features and compatibility with the Matter standard.
What’s Next for Matter and the IoT World at Large
While the world adapts to and adopts Matter, Tuya is certain of one thing: the protocol is not going anywhere. The user experience of Matter devices will continue to improve, making them more accessible and appealing to consumers. Tuya envisions a future where most homes in the United States will have at least one Matter device within the next five years.
The MG24 SoC will play a crucial role in this vision, providing the necessary computing capability, RAM, and I/O flexibility to support sophisticated IoT systems. As the Matter standard evolves, Silicon Labs and Tuya will continue to collaborate closely, ensuring that their solutions remain at the forefront of the smart industry.
By simplifying the development process and addressing interoperability challenges, Tuya and Silicon Labs are paving the way for the widespread adoption of smarter, more robust, and easier-to-use smart devices. This collaboration not only accelerates smart innovation but also brings the dream of a fully connected, interoperable world closer to reality.