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BGM210PA22JIA

Optimal Performance, Security and Reliability for Line-Powered Bluetooth Solutions

The BGM210PA22JIA is a PCB module for Bluetooth connectivity built around the EFR32BG21 Wireless Gecko Series 2 SoC. It is designed and optimized for the needs of IoT solutions for the smart home and for commercial/industrial applications with hostile RF environments, including smart lighting and building/factory automation.

The module delivers unparalleled RF range and performance. It also offers a powerful and energy-efficient ARM Cortex-M33 MCU core, 1024 kB of flash memory to enable future-proofing capabilities and OTA firmware updates, and a dedicated core for enhanced security features. In addition, its extended temperature rating makes it suitable for applications subject to extreme operating environments.

Certified worldwide and supported by robust, industry-proven software and advanced development tools, the BGM210PA22JIA modules are a complete solution that can add Bluetooth networking capabilities to any design easily, minimizing development efforts, cost, and accelerating time to market.

Also available is the MGM210P Zigbee, and Thread multiprotocol module.

BGM210PA22JIA

Key Specs

 
Bluetooth 5
Yes
Bluetooth 5 LE Long Range
Yes
Bluetooth 2M PHY
Yes
Bluetooth ADV Extensions
Yes
Bluetooth Mesh
Yes
Bluetooth 5.1
Yes
Secure Vault
Base
Dimensions (mm)
12.9x15.0x2.2
TX Power (dBm)
10
RX Sensitivity (dBm)
-97
MCU Core
ARM Cortex-M33
Flash (kB)
1024
RAM (kB)
96
GPIO
20
Antenna
Built-in and RF Pin
Bluetooth 5
Yes
Bluetooth 5 LE Long Range
Yes
Bluetooth 2M PHY
Yes
Bluetooth ADV Extensions
Yes
Bluetooth Mesh
Yes
Bluetooth 5.1
Yes
Secure Vault
Base
Dimensions (mm)
12.9x15.0x2.2
TX Power (dBm)
10
RX Sensitivity (dBm)
-97
MCU Core
ARM Cortex-M33
Flash (kB)
1024
RAM (kB)
96
GPIO
20
Antenna
Built-in and RF Pin
EFR32BG21 Module Block Diagram
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