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FGM230SB27HGN

FGM230 Sub-GHz SiP Modules

FGM230S Series 2 wireless Module, FGM230SB27HGN, includes a 39 MHz ARM Cortex-M33 core, providing plenty of processing capability, while integrated security subsystem provides leading security features that greatly reduce the risk of IoT security breaches and compromised intellectual property. The device includes Secure Vault High, 512 kB Flash, 64 kB of RAM and is available in an ultra-compact 6.5 x 6.5 SiP module package. With up to 14 dBm maximum output power and an excellent sensitivity of 109.8 dBm, the FGM230SB27HGN provides a robust RF link for Sub-GHz applications. FGM230SB27HGN uses Simplicity Studio 5 development tools, provides easy migration and fast time to market with development kits, SDKs, mobile apps, and our patented network analyser.

FGM230SB27HGN

Key Specs

 
MCU Core
ARM Cortex-M33
Core Frequency (MHz)
39
Flash (kB)
512
RAM (kB)
64
Sub-GHz Capable
Yes
Package Type
SiP
Dig I/O Pins
34
Secure Vault
High
MCU Core
ARM Cortex-M33
Core Frequency (MHz)
39
Flash (kB)
512
RAM (kB)
64
Sub-GHz Capable
Yes
Package Type
SiP
Dig I/O Pins
34
Secure Vault
High
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