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MGM210LA22JIF

Zigbee and Thread EFR32MG21 Based Modules (Series 2)

MGM210LA22JIF devices are PCB modules for Zigbee, Thread, Bluetooth and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC and designed and optimized for the unique needs of smart LED lightbulbs. Delivering unparalleled RF performance and energy consumption compliance with CA Title 20, the module also offers a powerful and energy-efficient MCU core, 1024 kB of flash memory to enable future-proofing capabilities and over-the-air firmware updates with a dedicated core for enhanced security features. With its extended temperature rating and form factor, the device is suitable for enclosed operation in lightbulb housings.

Certified worldwide and supported by robust, industry-proven software and advanced development tools, MGM210LA22JIF modules are a complete solution to quickly add mesh and Bluetooth networking capabilities to any IoT design.

Also available is the BGM210L Bluetooth lighting module.

MGM210LA22JIF

Key Specs

 
Bluetooth 5.1
Yes
Zigbee
Yes
Thread
Yes
Multiprotocol
Yes
Secure Vault
Mid
Temperature (Min)
-40
Temperature (Max)
125
TX Power (dBm)
12.5
Flash (kB)
1024
RAM (kB)
96
GPIO
12
Package Size (mm)
15.5x22.5x2.2
MCU Core
ARM Cortex-M33
Bluetooth 5.1
Yes
Zigbee
Yes
Thread
Yes
Multiprotocol
Yes
Secure Vault
Mid
Temperature (Min)
-40
Temperature (Max)
125
TX Power (dBm)
12.5
Flash (kB)
1024
RAM (kB)
96
GPIO
12
Package Size (mm)
15.5x22.5x2.2
MCU Core
ARM Cortex-M33
MGM21 Module Block Diagram
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