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MGM210PA32JIA

Optimal Performance, Security and Reliability for Line-Powered Mesh Solutions

The MGM210PA32JIA is a PCB module for Zigbee, Thread, Bluetooth and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC. It is designed and optimized for the needs of IoT solutions for the smart home and for commercial/industrial applications with hostile RF environments, including smart lighting and building/factory automation.

The module delivers unparalleled RF range and performance. It also offers a powerful and energy-efficient ARM Cortex-M33 MCU core, 1024 kB of flash memory to enable future-proofing capabilities and OTA firmware updates, and a dedicated core for enhanced security features. In addition, its extended temperature rating makes it suitable for applications subject to extreme operating environments.

Certified worldwide and supported by robust, industry-proven software and advanced development tools, MGM210PA32JIA modules are a complete solution that can add mesh and Bluetooth networking capabilities to any design easily, minimizing development efforts, cost, and accelerating time to market.

Also available is the BGM210P Bluetooth module.

MGM210PA32JIA

Key Specs

 
Bluetooth 5.1
Yes
Zigbee
Yes
Thread
Yes
Multiprotocol
Yes
Secure Vault
Mid
Temperature (Min)
-40
Temperature (Max)
125
TX Power (dBm)
20
Flash (kB)
1024
RAM (kB)
96
GPIO
20
Package Size (mm)
12.9x15.0x2.2
MCU Core
ARM Cortex-M33
Bluetooth 5.1
Yes
Zigbee
Yes
Thread
Yes
Multiprotocol
Yes
Secure Vault
Mid
Temperature (Min)
-40
Temperature (Max)
125
TX Power (dBm)
20
Flash (kB)
1024
RAM (kB)
96
GPIO
20
Package Size (mm)
12.9x15.0x2.2
MCU Core
ARM Cortex-M33
MGM21 Module Block Diagram
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