EFR32MG21 Based Modules (Series 2)

MGM210 Zigbee, Thread, Bluetooth and multiprotocol modules feature an optimized low-profile form-factor with either an integrated chip or PCB antenna for space-constrained IoT designs including smart lighting, HVAC, building and factory automation systems. The module is offered in two form factors:

  • The MGM210P comes in a PCB package with a chip antenna and supports both Secure Vault™ Mid and High. More information on Silicon Labs' security portfolio can be found here.
  • The MGM210L offers a custom form factor with a PCB trace antenna designed to simplify mounting inside LED bulb housings. The modules are designed to maximize wireless range, operate in higher temperature ratings, and come with extensive global regulatory certifications to deliver the perfect wireless solution for cost-sensitive, high-volume smart LED lightbulbs.
Ideal Applications
Lighting & Building Automation
Highest level of IoT Security
Secure Vault

You can start developing Matter solutions using the EFR32MG21 Series 2 Modules

EFR32MG21 Module Specs

Supported Protocols:

  • Zigbee
  • Thread
  • Bluetooth 5.1
  • Bluetooth Mesh
  • Multiprotocol (Zigbee + Bluetooth 5.1)

Regulatory Certifications:     

  • MGM210P
    • CE and UKCA - EU and UK
    • FCC - USA
    • ISED - Canada
    • MIC - Japan
    • KC - South Korea
  • MGM210L
    • CE, UKCA, FCC, ISED
    • Japan, South Korea
    • China, Taiwan, Hong Kong
    • Australia, Dominican Republic, Israel, Jordan, Kuwait, Mexico
    • Serbia, Singapore, Thailand, Bahrain, Qatar, UAE
    • Oman, Saudi Arabia, Egypt, Morocco

Operating Range & Size:

  • MGM210P
    • 1.71 V to 3.8 V
    • -40 °C to +125 °C
    • 12.9 mm × 15.0 mm × 2.2 mm
  • MGM210L
    • 1.8 V to 3.8 V
    • -40 °C to +105 °C or -40 °C to +125 °C
    • 15.5 mm × 22.5 mm  (custom form factor)

Wireless SoC:

  • 2.4 GHz Radio
  • ARM Cortex -M33 MCU Core
  • 1024 kB Flash
  • 96 kB RAM
  • Up to +20 dBm TX power (MGM210P)
  • Up to +12.5 dBm TX power (MGM210L)

Current Consumption:

  • MGM210P
    • 9.3 mA RX current at 1 Mbps GFSK
    • 16.1 mA TX current at 0 dBm (MGM210Px22)
    • 34.1 mA TX current at 10 dBm (MGM210Px22)
    • 181.3 mA TX current at 20 dBm (MGM210Px32)
    • 50.9 µA/MHz in Active Mode (EM0)
    • 5.1 μA EM2 DeepSleep current
  • MGM210L
    • 9.3 mA RX current at 1 Mbps GFSK
    • 70 mA TX current at 12.5 dBm output power
    • 50.9 µA/MHz in Active Mode (EM0)
    • 5.1 μA EM2 DeepSleep current

MCU Peripherals:

  • 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
  • 2 × Analog Comparator (ACMP)
  • 20 General Purpose I/O pins with output state retention and asynchronous interrupts (MGM210P)
  • 12 General Purpose I/O pins with output state retention and asynchronous interrupts (MGM210L)
  • 8 Channel DMA Controller
  • 12 Channel Peripheral Reflex System (PRS)
  • 3 × 16-bit Timer/Counter (3 Compare/Capture/PWM channels)
  • 1 × 32-bit Timer/Counter (3 Compare/Capture/PWM channels)
  • 32-bit Real Time Counter
  • 24-bit Low Energy Timer for waveform generation
  • 2 × Watchdog Timer
  • 3 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
  • 2 × I2C interface with SMBus support

Status

Find the Right EFR32MG21 Series 2 Module Select Columns
Select Columns
Part Number Pricing Protocols Supported Secure Vault Temperature Range ºC TX Power (dBm) Flash RAM GPIO Antenna Package Size (mm) MCU Core
1K @ US$7.4 Bluetooth 5.1 Zigbee Thread Multiprotocol High -40 125 20 1024 96 20 Built-in and RF Pin 12.9 x 15.0 x 2.2 ARM Cortex-M33
1K @ US$- Bluetooth 5.1 Zigbee Thread Multiprotocol Mid -40 125 12.5 1024 96 12 Built-in 15.5x22.5x2.2 ARM Cortex-M33
1K @ US$- Bluetooth 5.1 Zigbee Thread Multiprotocol Mid -40 105 12.5 1024 96 12 Built-in 15.5x22.5x2.2 ARM Cortex-M33
1K @ US$6.61 Bluetooth 5.1 Zigbee Thread Multiprotocol Mid -40 125 10 1024 96 20 Built-in and RF Pin 12.9x15.0x2.2 ARM Cortex-M33
1K @ US$7.11 Bluetooth 5.1 Zigbee Thread Multiprotocol Mid -40 125 20 1024 96 20 Built-in and RF Pin 12.9x15.0x2.2 ARM Cortex-M33

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