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BGM11S12F256GA

The World's Smallest, Fully Certified Bluetooth SiP Module

Silicon Labs’ BGM11S12F256GA EFR32BG1 Series 1 System-in-Package Bluetooth Module with +3 or +8 dBm TX power, is targeted for applications where ultra-small size, reliable high-performance RF, low-power consumption, full modular certification, and easy application development are key requirements. At 6.5 x 6.5 x 1.4 mm the BGM11S12F256GA module fits applications where size is a constraint. The device also integrates a high performance, ultra-robust antenna, which requires minimal PCB, plastic and metal clearance. The total PCB area required by BGM11S12F256GA is only 51 mm². The module also integrates a Bluetooth 4.2 compliant Bluetooth stack and it can also run end-user applications on-board or alternatively used as a network co-processor over one of the host interfaces. Additionally, the BGM11S12F256GA has a metal shield enabling full modular certification for WW regulatory compliance.
BGM11S12F256GA

Key Specs

 
Antenna
Built-in
Package
SiP
BLE
Yes
Bluetooth 5
No
Range (m)
up to 50
Dimensions (mm)
6.5 x 6.5 x 1.4
TX Power
2
RX Sensitivity
-90
MCU Core
ARM Cortex-M4
RAM (kB)
32
Flash (kB)
256
Antenna
Built-in
Package
SiP
BLE
Yes
Bluetooth 5
No
Range (m)
up to 50
Dimensions (mm)
6.5 x 6.5 x 1.4
TX Power
2
RX Sensitivity
-90
MCU Core
ARM Cortex-M4
RAM (kB)
32
Flash (kB)
256
EFR32BG1 Module Block Diagram
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