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SiWx917Y Wi-Fi® 6 plus Bluetooth® Low Energy LE 5.4 Modules

Our SiWx917Y Wireless Module provides ultra-low-power Wi-Fi 6 and Bluetooth Low Energy LE 5.4 multiprotocol 2.4 GHz connectivity for energy-sensitive and battery-powered IoT devices. With the integrated antenna and worldwide RF regulatory certifications, the SiWx917Y Wireless Module reduces the time and costs needed for development and certifications. The ARM® Cortex®-M4 application microcontroller subsystem, Matter-support, large memory, Sensor Hub, and a rich set of peripherals make the SiWx917Y Wireless Module a versatile solution for any IoT use case. The intelligent power management delivers high-performance, long-range Wi-Fi 6 connectivity at the lowest power in its class, maximizing battery life and minimizing energy consumption for smart IoT devices.

Our SiWx917Y Module packs a fully integrated, shielded IoT wireless computing solution with an antenna, and worldwide RF-certifications in a package with dimensions of 16 x 21 x 2.3 mm. There are multiple orderable part numbers (OPN) available with different antenna, PSRAM, and Flash configurations and three operational modes: hostless system-on-chip (SoC), network co-processor (NCP), and radio co-processor (RCP), offering an optimal solution for IoT applications such as Smart Homes, Smart Cameras, Appliances, Consumer Health and Wearables, Clinical Medical, Industrial, Smart Building, and Asset Tracking.

The wireless subsystem consists of a network wireless processor running up to 160 MHz, baseband digital signal processing, analog front-end, RF transceiver, and integrated power amplifier. The application subsystem consists of an ARM® Cortex® M4 Processor with FPU subsystem running up to 180 MHz dedicated to peripheral and application processing. The high-performance dual-core architecture runs the applications and wireless stacks on separate cores to maximize performance and throughput and to guarantee timely processing of time-sensitive applications.

The SiWx917Y modules support RF regulatory certifications worldwide. They have modular radio type approvals for countries such as the USA (FCC), Canada (IC/ISED), MIC (Japan), and more. They also comply with the relevant EN standards (including EN 300 328 v2.2.2) for conformity with the directives and regulations in the EU (CE) and UK (UKCA) (Contact Silicon Labs sales for more details).

 

Contact Sales below for product details, availability, and data sheet.

Wi-Fi 6 and Bluetooth LE 5.4, Matter ready
Integrated MCU
ARM® Cortex®-M4 processor with FPU

SiWx917Y Module Common Specs

Wi-Fi 6

  • Wi-Fi 6, 802.11 b/g/n/ax, Single Band, 2.4 GHz, 20 MHz channel
  • Bandwidth 86 Mbps (802.11ax MCS0-MCS7)
  • 802.11ax 20 MHz non-AP STA mandatory features and optional features of individual Target Wakeup Time (iTWT), Broadcast TWT (bTWT)*, Intra PPDU power save*, SU extended range (ER). DL MU-MIMO, BFRP, NDP feedback up to 4 antennas
  • Frequency: 2412 MHz – 2484 MHz
  • Up to +17 dBm Transmit (Tx) power with integrated PA
  • -96 dBm Receive (Rx) sensitivity
  • Integrated Wi-Fi stack, TCP/IP stack, Bluetooth stack supporting wireless coexistence and Matter

Bluetooth Low Energy 5.4

  • Bluetooth LE 1Mbps, 2Mbps, LR (125Kbps, 500Kbps) data rates
  • 8 Peripheral and 2 Central connections*
  • LR duty cycling*
  • Transmit (TX) power up to +16.5 dBm with integrated PA

Wireless Certifications

  • Wi-Fi Alliance, Bluetooth SIG
  • USA (FCC), Canada (IC/ISED), MIC (Japan), etc. Compliance with the relevant EN standards including EN 300 328 v2.2.2 for conformity with the directives and regulations in the EU (CE) and UK (UKCA) (Contact Silicon Labs sales for more details).

MCU and Peripherals

  • Microcontroller
    • ARM® Cortex®-M4 Processor with FPU subsystem up to 180 MHz 225 DMIPS performance
    • Integrated FPU, MPU, and NVIC
    • SWD and JTAG debug options
    • Internal and external oscillators with PLLs
    • Flash In-Application Programming (IAP), In-System Programming (ISP) and Over-the-Air Wireless Firmware Upgrade
    • Power on reset (POR) Brown-Out and Black-Out Detect (BOD) with separate thresholds
    • Matrix vector processor (MVP)
    • M4 has 2 dedicated QSPI controllers for PSRAM and Flash
  • Analog Peripherals
    • 12-bit 16-ch, 2.5 Msps ADC, 10-bit DAC
    • 3x Op-amps 2x Comparators, IR detector and Temp Sensor
  • Digital Peripherals
    • SDIO 2.0 Secondary
    • 1 x USART, 2 x UART, 4 x SPI, 3 x I2C, 2 x I2S, SI
    • Timers: 4 x 16/32-bit, 1 x 24-bit, WDT, RTC
    • Up to 43 GPIOs with GPIO multiplexer
  • Memory
    • 672 kB embedded SRAM shared by ARM® Cortex® M4 and network wireless processor
    • Up to 2 MB embedded PSRAM. Support for external PSRAM up to 16 MB
    • Up to 8 MB embedded Flash. Up to 16 MB external Flash

Security

  • WPA2 (Personal/Enterprise), WPA3 (Personal), TLS1.3
  • Sevure Boot/OTA, PUF, TRNG, Secure Zone Key Storage, Debug Lock, Anti Rollback, Encrypted XiP, Secure Attestation
  • HW Accelerators: AES-128/256, SHA-256/384/512, HMAC, RSA, ECC, ECDH, RNG, CRC, SHA-3, AES-GCM / CMAC, ChaCha-poly, TRNG

Operating Range

  • Voltage: 1.65 V to 3.63 V
  • Operating temperature: -40°C to +85°C  

Dimensions

  • 16 mm x 21.1 mm x 2.3 mm

Development Environment

  • Simplicity Studio v5, unified development platform
  • VS Code
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Whitepaper

Harnessing the Power of Wi-Fi 6 in the New Age of IoT

This whitepaper covers the rapid evolution of Wi-Fi over the last two decades and dive into the value of Wi-Fi 6 for IoT devices.

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