WGM160 Series 1 Wi-Fi Modules

WGM160 devices are secure, low-power, fully certified Wi-Fi modules designed specifically for IoT applications. With a 2.4 GHz 802.11 b/g/n Wi-Fi radio and a 72 MHz Cortex M4 MCU, the device can run the complete Wi-Fi Stack, TCP/IP stack, and your applications. Advanced peripherals like an Ethernet MAC and cap touch allow you to reduce BOM and add features to your products. WGM160 modules are available with or without a built-in antenna (reduces BOM) and an LF XTAL (lower sleep current for Wi-Fi). The earlier version of WGM160P module comes with Gecko OS kernel preloaded in the flash while the new version is without the Gecko OS kernel loaded. Thus, there is no need to remove it before loading a FMAC based application.

Reduce time-to-market
Fully certified Wi-Fi module
Advanced peripherals
Ethernet and capacitive touch

WGM160 Common Specs

    Standards/IEEE 802.11 and WFA
  • b - symbol rates: up to 11 Mbps
  • g - symbol rates: up to 54 Mbps
  • n - symbol rates: up to 72.2 Mbps
  • d - regulatory domains
  • e - QoS as per definition in WMM specification
  • i - as per definition in WPA2 specification
  • w - protected management frames
  • WMM Power save
  • WPA/WPA2 Personal
  •  
    Key RF Features
  • 1x1 802.11n with full 802.11 b/g compatibility, 72.2 Mbps
  • Greenfield Tx/Rx for 802.11n optimal performance
  • Short Guard Interval (SGI) for 802.11n optimal throughput
  • A-MPDU Rx and Tx for high MAC throughput
  • Block acknowledgement for several frames
  • Rx defragmentation
  • Roaming supported
  • Client, SoftAP modes supported
  • Concurrent AP + STA supported
  • Tx Power: +16 dBm
  • Rx Sensitivity: -95.5 dBm
  • 2 x 2.4 GHz antenna pads for full antenna diversity support
  • 2.4 GHz co-existence; 2-, 3- and 4-wire PTA support
    Certifications
  • FCC, CE, ISED/IC, KCC and MIC/TELEC certified
  •  
    Power Consumption
  • Rx (@1DSSS): 34.5 mA
  • Tx (16 dBm @1DSSS): 141.3 mA
  • Associated: DTIM3: 270 μA
  • Idle: SLEEP: 90 μA
  • Power off: < 0.7 μA
  •  
    Security and Encryption Features
  • AES/WEP hardware acceleration
  •  
    MCU Features and Host Interfaces
  • ARM Cortex-M4 at 72 MHz
  • Onboard Flash: 2048 kB
  • Onboard RAM: 512 kB
  • Ultra-low energy operation
  • 80 µA/MHz in Energy Mode 0 (EM0)
  • 2.1 μA EM2 Deep Sleep current (RTCC running with state and RAM retention)
  • Hardware cryptographic engine supports AES, ECC, SHA and TRNG
  • UART and USB serial interfaces
  •  
    Package Details
  • PCB module dimensions - 23.8 x 14.2 x 2.3 mm
    Peripheral Interfaces
  • 12-bit ADC
  • 12-bit DAC
  • GPIO
  • 2 x USART (UART/SPI/I2S)
  • QSPI with Execute In Place (XIP) support
  • Capacitive Touch Sensing in all GPIOs
  • LESENSE
  • 10/100 Ethernet MAC with RMII interface
  • USB device (2.0 Full speed)
  • I2C peripheral interfaces
  • CAN
  • Timers
  • 5 V tolerant I/O
  •  
    ROHS/REACH Compliant
     
    Electrical Characteristics:
  • 3.0 - 3.6 V
  •  
    Temperature range:
  • -40 to +85 °C

Status

WFM160 Module Select Columns
Select Columns
Part Number Protocol Antenna LFXTAL TX Power (dBm) MCU Core RAM Flash Package Size (mm)
2.4 GHz, b/g/n, 1x1, 20 MHz Built-In 16 ARM Cortex-M4 512 2048 23.8x14.2x2.3
2.4 GHz, b/g/n, 1x1, 20 MHz External (RF Pin) 16 ARM Cortex-M4 512 2048 23.8x14.2x2.3
2.4 GHz, b/g/n, 1x1, 20 MHz Built-In 16 ARM Cortex-M4 512 2048 23.8x14.2x2.3
2.4 GHz, b/g/n, 1x1, 20 MHz External (RF Pin) 16 ARM Cortex-M4 512 2048 23.8x14.2x2.3

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