EFR32MG27C140F768IM32
SPECS
Key Specs
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MCU Core
ARM Cortex-M33
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Core Frequency (MHz)
76.8
|
Flash (kB)
768
|
||
|
RAM (kB)
64
|
Secure Vault
Mid
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Max Output Power
8
|
||
|
GPIO
18
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Temperature (Max)
125
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Package Type
QFN32
|
||
|
Zigbee Capable
Yes
|
Thread Capable
No
|
Bluetooth Low Energy Capable
Yes
|
||
|
2.4 GHz Capable
Yes
|
Sub-GHz Capable
No
|
DCDC
Buck
|
||
|
MCU Core
ARM Cortex-M33
|
|
Core Frequency (MHz)
76.8
|
|
Flash (kB)
768
|
|
RAM (kB)
64
|
|
Secure Vault
Mid
|
|
Max Output Power
8
|
|
GPIO
18
|
|
Temperature (Max)
125
|
|
Package Type
QFN32
|
|
Zigbee Capable
Yes
|
|
Thread Capable
No
|
|
Bluetooth Low Energy Capable
Yes
|
|
2.4 GHz Capable
Yes
|
|
Sub-GHz Capable
No
|
|
DCDC
Buck
|
EFR32xG27 Pro Kit +8 dBm
The EFR32xG27 +8 dBm Pro Kit (xG27-PK6017A) is designed to support the development of wireless IoT devices based on the EFR32xG27 and support the development of 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Pro Kit +8 dBm
The EFR32xG27 +8 dBm Pro Kit (xG27-PK6017A) is designed to support the development of wireless IoT devices based on the EFR32xG27 and support the development of 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Pro Kit +4 dBm (Buck)
The EFR32xG27 +4 dBm Pro Kit (xG27-PK6018A) is designed to support the development of wireless IoT devices based on the EFR32xG27 in the CSP package and support the development of 2.4 GHz wireless protocols including BLE, and Bluetooth mesh.
EFR32xG27 Pro Kit +4 dBm (Buck)
The EFR32xG27 +4 dBm Pro Kit (xG27-PK6018A) is designed to support the development of wireless IoT devices based on the EFR32xG27 in the CSP package and support the development of 2.4 GHz wireless protocols including BLE, and Bluetooth mesh.
EFR32xG27 Development Kit
The EFR32xG27 Dev Kit (xG27-DK2602A) is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +8 dBm output power and includes support for the 16-bit ADC as well as other key features.
EFR32xG27 Development Kit
The EFR32xG27 Dev Kit (xG27-DK2602A) is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +8 dBm output power and includes support for the 16-bit ADC as well as other key features.
EFR32xG27 Wireless 2.4 GHz +8 dBm Radio Board
The EFR32xG27 +8 dBm Radio Board (xG27-RB4194A) is designed work with the WSTK main board (not included) to support the development of wireless IoT devices based on 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Wireless 2.4 GHz +8 dBm Radio Board
The EFR32xG27 +8 dBm Radio Board (xG27-RB4194A) is designed work with the WSTK main board (not included) to support the development of wireless IoT devices based on 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
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TECH DOCS
SOFTWARE & TOOLS
EFR32xG27 Pro Kit +8 dBm
The EFR32xG27 +8 dBm Pro Kit (xG27-PK6017A) is designed to support the development of wireless IoT devices based on the EFR32xG27 and support the development of 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Pro Kit +8 dBm
The EFR32xG27 +8 dBm Pro Kit (xG27-PK6017A) is designed to support the development of wireless IoT devices based on the EFR32xG27 and support the development of 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Pro Kit +4 dBm (Buck)
The EFR32xG27 +4 dBm Pro Kit (xG27-PK6018A) is designed to support the development of wireless IoT devices based on the EFR32xG27 in the CSP package and support the development of 2.4 GHz wireless protocols including BLE, and Bluetooth mesh.
EFR32xG27 Pro Kit +4 dBm (Buck)
The EFR32xG27 +4 dBm Pro Kit (xG27-PK6018A) is designed to support the development of wireless IoT devices based on the EFR32xG27 in the CSP package and support the development of 2.4 GHz wireless protocols including BLE, and Bluetooth mesh.
EFR32xG27 Development Kit
The EFR32xG27 Dev Kit (xG27-DK2602A) is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +8 dBm output power and includes support for the 16-bit ADC as well as other key features.
EFR32xG27 Development Kit
The EFR32xG27 Dev Kit (xG27-DK2602A) is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +8 dBm output power and includes support for the 16-bit ADC as well as other key features.
EFR32xG27 Wireless 2.4 GHz +8 dBm Radio Board
The EFR32xG27 +8 dBm Radio Board (xG27-RB4194A) is designed work with the WSTK main board (not included) to support the development of wireless IoT devices based on 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
EFR32xG27 Wireless 2.4 GHz +8 dBm Radio Board
The EFR32xG27 +8 dBm Radio Board (xG27-RB4194A) is designed work with the WSTK main board (not included) to support the development of wireless IoT devices based on 2.4 GHz wireless protocols including BLE, Bluetooth mesh, and Zigbee.
QUALITY & PACKAGING
Quality Assurance, Environmental and Packaging Information
Silicon Labs targets a minimum of a 10-year lifecycle for all of its standard products and expects to produce the EFR32MG27C140F768IM32 until at least June 2033.
The longevity date shown above is for the preferred revision of this part number, for a complete list of part number revisions, use the search button below.
As part of its ongoing commitment to supply continuity, Silicon Labs may provide pin-compatible and functionally equivalent replacement products if Silicon Labs determines, at its discretion, that supply chain adjustments, product improvements, market conditions, or similar business or technical issues make this necessary or advisable.
If for business, technical or other reasons beyond Silicon Labs’ reasonable control, Silicon Labs finds that it is necessary to discontinue a product, our policy is to issue an EOL notice that provides 6 months from notice to place final orders and 12 months from notice for final shipments. This policy complies with the JEDEC standard EIA/JESD48 that is commonly used in the semiconductor industry. We provide the required support for a product for its full life cycle.
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COMMUNITY & SUPPORT
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